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  • 廣州市紅太電子科技有限公司

    地  址:廣州市南沙區欖核鎮平穩村第三工業(yè)區第二棟

    傳  真:020-34986800

    聯(lián)系人:楊小姐

    電話(huà): 020-34986880

    業(yè)務(wù)電話(huà):13318791398

    郵  箱:hongtaiym@126.com

    網(wǎng)  站:www.0394auto.cn

產(chǎn)品詳細
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點(diǎn)擊次數:2623  更新時(shí)間:2019-07-25   【打印此頁(yè)】  【關(guān)閉

易操作使用,具有優(yōu)良的塞孔性能、低收縮,抗裂和良好的附著(zhù)力、耐熱性以及耐化性能。

1、塞孔同面油同時(shí)進(jìn)行,保證塞孔平整,經(jīng)過(guò)高溫后僅出現微收縮;

Plughole and printing surface at the same time to ensure the smooth , occurs only the shrinkage in the hole after the high temperature ;

2、塞孔飽滿(mǎn),孔中油墨基本沒(méi)有氣泡、貫穿和裂紋;

Full plug holes basically no bubbles, through and crack;

3、流程簡(jiǎn)單,塞孔可與面油印刷同時(shí)在無(wú)塵室完成,直接采用絲網(wǎng)印塞后印面油,按正常絲印流程進(jìn)行即可;

A simple process, directly plug hole by the screen printing ,then printing surface in a clean room according to the normal printing process;

4、過(guò)五次回流焊后,孔內無(wú)變化;沒(méi)有裂紋,分層和起泡。

No change in the hole after five times Reflow soldering. No tackiness, delamination or blistering.

HT-50 PS-1A low halogen photoimageable plug hole solder mask data sheet

一、性能介紹Features

     易操作使用,具有優(yōu)良的塞孔性能、附著(zhù)力、耐熱性和良好的耐化性能。

     Easy operation, good adhesion, heat resistance and good performance for plug hone ,electric gold, immersion gold.

二、技術(shù)資訊Specification:

                產(chǎn)品名稱(chēng) 

            Product name                  
 
項目

Items

HT-50 PS-1A

顏色
 Color

綠色

Green

粘度(主劑)
 Viscosity(main agent)

25℃,粘度計/Brookfield Viscometer DV2T

400±20dPa.s

混合比例
 Mixing ratio

主劑:硬化劑=65:35
 Main agent: Hardener=65:35

混合后使用期限
 Pot life after mixing

24小時(shí)(25℃以下暗處保存)

24hours(Store in dark place below 25℃)

保存期限
 Shelf life

制造后6個(gè)月
 6 months after production

附著(zhù)力
 Adhesion

100/100

鉛筆硬度)
 Hardness

6H

耐溶劑性
 Solvent resistence

PGM-AC,室溫下浸泡30min后,以3M膠帶做拉力測試,無(wú)油墨脫落
 
PGM-Ac immersion 30 min at room temperature, no peel off after tape test.

耐酸性
 Acid resistance

10vol%H2SO4(aq),室溫下浸泡30min后,以3M膠帶做拉力測試 ,無(wú)油墨脫落
 
10vol%H2SO4 immersion 30  min at room temperature, no peel off  after tape test.

耐堿性
 Alkaline resistance

10wt%NaOH(aq),室溫下浸泡30min后,以3M膠帶做拉力測試,無(wú)油墨脫落
 
10 wt% NaOH immersion 30 min at room temperature,  no peel off after tape test.

耐焊錫
 Solder resistance

260℃×10sec×3times

絕緣電阻

Insulation resistance

≥1.2×1011Ω

包裝
 Potting

1kg/套,4kg/套
 1kg/set,4kg/set

三、操作程序Process recommendations:

           產(chǎn)品名稱(chēng) 

         Product name                  
 
項目

Items

HT-50 PS-1A

注意事項

notes

調油

Mixing

主劑和固化劑混合后攪拌5-10min,靜置10min以上再使用

Stir 5-10min after the main agent and hardener mixing, hold 10min or more  before using

Printing for plug hole

前處理Pretreat

酸洗→磨刷→噴刷→高壓水洗→水洗→烘干
 金剛砂濃度:18-22%
 酸洗H2SO4濃度:3%-5%

Acid washing→Scrubbing→Spray brush→High pressure water washing,→Rinsing→Drying

Emery concentration: 18-22%
 H2SO4 concentration: 3%-5%

磨痕測試:12-18mm
 水破測試:≧30s
 噴痕測試:同板面不同位置噴嘴堵塞≤5個(gè)

The grinding mark  test: 12 to 18 mm
 The water break test:
≧ 30 s
 Spray mark test: with different location of the nozzle  clogging
≤5

絲印

Screen printing

 

塞孔鋁片:鋁片厚度0.3mm

刮刀:厚度20mm,硬度70度

Plug hole aluminum thickness:  0.3mm

Squeegee thickness :20mm, hardness:  70degree

絲印完成后靜置10min以上再進(jìn)行預烤

Recommend to hold 10 minutes before prebaking

預烤

Pre curing

雙面烘干:75℃×35-45min

Double-sided:75℃×35-45min

預烤后靜置15min以上再進(jìn)行曝光,靜置時(shí)間不可超過(guò)24hr. Hold above 15min , but no more than 24hr after prebaking

曝光Exposure

600~800mJ/ cm2,21級曝光尺:10-13格蓋膜

600~800mJ/ cm2,Stouffer  21 steps :10-13steps cover coating

曝光后靜置15min以上再進(jìn)行顯影,靜置時(shí)間不可超過(guò)24hr. Hold above 15min , but no more than 24hr after exposure

顯影Developing

Na2CO3濃度:0.8-1.2%     
 溫度:28-32℃
 噴淋壓力:1.5-2.0kg/cm2
 時(shí)間:55-70sec
 PH值:9-11

Na2CO3 concentration: 0.8-1.2%

Temperature: 28-32

Spray pressure: 1.5-2.0kg/cm2

Time: 55-70sec

PH value: 9-11

A.上噴淋比下噴淋壓力大0.2kg/cm2可以預防卡板
 B.顯影點(diǎn)控制:50-60%

A. The above spray pressure is larger than the below spray  pressure 0.2kg/cm2 can prevent the plug board
 B. Developing point control: 50-60%

后烤

Final curing


 65-170
℃×16-18倉,時(shí)間70-180分鐘。

65-170℃×16-18 oven, time:70-180 minutes.

 

如塞孔板或厚銅板要求先低溫分段烤后再高溫固化

A plug hole or thick copper of PCB request five sections of baking at low  temperature before high temperature curing

注明:以上為建議參數,現場(chǎng)使用時(shí)請根據自身工藝設備的實(shí)際情況進(jìn)行調整。

Note: the above is the recommended parameters, on-site use, according to the actual situation of their own equipment to adjust.

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