HT-50 PS-1A low halogen photoimageable plug hole solder mask data
sheet
一、性能介紹Features：
易操作使用，具有優(yōu)良的塞孔性能、附著(zhù)力、耐熱性和良好的耐化性能。
Easy operation, good adhesion,
heat resistance and good performance for plug hone ,electric gold, immersion
gold.
二、技術(shù)資訊Specification:
產(chǎn)品名稱(chēng) Product name
項目 Items | HT-50 PS-1A |
顏色
Color | 綠色 Green |
粘度（主劑）
Viscosity(main agent) | 25℃,粘度計/Brookfield Viscometer DV2T |
400±20dPa.s |
混合比例
Mixing ratio | 主劑：硬化劑=65:35
Main agent: Hardener=65:35 |
混合后使用期限
Pot life after mixing | 24小時(shí)（25℃以下暗處保存） 24hours(Store in dark place below 25℃) |
保存期限
Shelf life | 制造后6個(gè)月
6 months after production |
附著(zhù)力
Adhesion | 100/100 |
鉛筆硬度)
Hardness | 6H |
耐溶劑性
Solvent resistence | PGM-AC，室溫下浸泡30min后，以3M膠帶做拉力測試，無(wú)油墨脫落
PGM-Ac immersion 30 min at room temperature, no peel off after tape test. |
耐酸性
Acid resistance | 10vol%H2SO4（aq），室溫下浸泡30min后，以3M膠帶做拉力測試 ，無(wú)油墨脫落
10vol%H2SO4 immersion 30
min at room temperature, no peel off
after tape test. |
耐堿性
Alkaline resistance | 10wt%NaOH(aq)，室溫下浸泡30min后，以3M膠帶做拉力測試，無(wú)油墨脫落
10 wt% NaOH immersion 30 min at room temperature,
no peel off after tape test. |
耐焊錫
Solder resistance | 260℃×10sec×3times |
絕緣電阻 Insulation resistance | ≥1.2×1011Ω |
包裝
Potting | 1kg/套，4kg/套
1kg/set，4kg/set |
三、操作程序Process recommendations:
產(chǎn)品名稱(chēng) Product name
項目 Items | HT-50 PS-1A | 注意事項 notes |
調油 Mixing | 主劑和固化劑混合后攪拌5-10min，靜置10min以上再使用 Stir 5-10min after the main agent and hardener mixing, hold 10min or more
before using | Printing for plug hole |
前處理Pretreat | 酸洗→磨刷→噴刷→高壓水洗→水洗→烘干
金剛砂濃度：18-22%
酸洗H2SO4濃度：3%-5% Acid washing→Scrubbing→Spray brush→High pressure water washing,→Rinsing→Drying Emery concentration: 18-22%
H2SO4 concentration: 3%-5% | 磨痕測試：12-18mm
水破測試：≧30s
噴痕測試：同板面不同位置噴嘴堵塞≤5個(gè) The grinding mark
test: 12 to 18 mm
The water break test: ≧ 30 s
Spray mark test: with different location of the nozzle
clogging ≤5 |
絲印 Screen printing | 塞孔鋁片：鋁片厚度0.3mm 刮刀：厚度20mm，硬度70度 Plug hole aluminum thickness:
0.3mm Squeegee thickness :20mm, hardness:
70degree | 絲印完成后靜置10min以上再進(jìn)行預烤 Recommend to hold 10 minutes before prebaking |
預烤 Pre curing | 雙面烘干：75℃×35-45min Double-sided：75℃×35-45min | 預烤后靜置15min以上再進(jìn)行曝光，靜置時(shí)間不可超過(guò)24hr. Hold above 15min , but no more than 24hr after prebaking |
曝光Exposure | 600～800mJ/ cm2，21級曝光尺：10-13格蓋膜 600～800mJ/ cm2，Stouffer
21 steps :10-13steps cover coating | 曝光后靜置15min以上再進(jìn)行顯影，靜置時(shí)間不可超過(guò)24hr. Hold above 15min , but no more than 24hr after exposure |
顯影Developing | Na2CO3濃度：0.8-1.2%
溫度：28-32℃
噴淋壓力：1.5-2.0kg/cm2
時(shí)間：55-70sec
PH值：9-11 Na2CO3 concentration: 0.8-1.2% Temperature: 28-32℃ Spray pressure: 1.5-2.0kg/cm2 Time: 55-70sec PH value: 9-11 | A.上噴淋比下噴淋壓力大0.2kg/cm2可以預防卡板
B.顯影點(diǎn)控制：50-60% A. The above spray pressure is larger than the below spray
pressure 0.2kg/cm2 can prevent the plug board
B. Developing point control: 50-60% |
后烤 Final curing |
65-170℃×16-18倉,時(shí)間70-180分鐘。
65-170℃×16-18 oven, time：70-180 minutes. | 如塞孔板或厚銅板要求先低溫分段烤后再高溫固化 A plug hole or thick copper of PCB request five sections of baking at low
temperature before high temperature curing |
注明：以上為建議參數，現場(chǎng)使用時(shí)請根據自身工藝設備的實(shí)際情況進(jìn)行調整。
Note: the above is the recommended parameters, on-site use,
according to the actual situation of their own equipment to adjust.
